electronics x ray system
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EMS SMT PCB Điện tử Máy X Ray BGA QFN LED hàn Void Thiết bị kiểm tra NDT
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, ...
Máy điện tử tiêu đề 2.5D Máy X Ray 40W Xoay 360 ° với chuyển động 6 trục
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation ...
Micro Focus Electronics X Ray System Hệ thống điện tử SMT Kiểm soát khuyết tật bên trong
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area ...
Thuật toán FPD Máy X Ray điện tử 1.0kW cho máy hàn dòng chảy LED
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
CNC kiểm tra tự động có thể lập trình Máy X quang điện tử AX9100MAX với góc nghiêng 60 ° để đo độ cong IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Hệ thống X Ray Điện tử Độ phóng đại Cao để Kiểm tra Void / QFN / PoP của BGA
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area ...
Phát hiện lập trình CNC Điện tử X Ray Máy Golf Ball Kiểm tra chất lượng bên trong
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
Máy điện tử đa chức năng X Ray Thời gian thực tốc độ cao cho bóng vàng
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
Kiểm tra PCB PCB Điện tử X Ray Máy Golf Ball Kiểm tra chất lượng bên trong
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
