industrial inspection systems
"
Ống kín Unicomp X Ray Interactive Touch 90kV Benchtop cho kim cảm ứng
Unicomp Factory directly supply of 90kV X-ray machineto find medical indwelling needle inside crack defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
Bộ điều khiển Microfocus 2.5D Unicomp X Ray AX8200 Max 5um 6 trục cho thiết bị điện tử
Unicomp AX8200Max 5um microfocus 2.5D X Ray Machine with 6 Axis Manipulator For Automotive electronics quality checking Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3.
Đóng ống Unicomp X Ray AX8200 Max 5μM cho điện tử ô tô
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
Ngoại tuyến AX8200Max SMT EMS X Ray Máy đo tự động
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
Thiết bị tia X Unicomp UNC320 NDT với bộ điều khiển chéo để đúc nhôm
Automotive steering knuckle aluminum casting tested by Unicomp NDT X-Ray UNC320 with Cross Over manipulator X-ray flaw detection is the difference in the degree of X-ray absorption by using different thicknesses of materials. By using X-ray fluoroscopy and industrial television real-time imaging, the internal defects of materials, parts, and welds are revealed from the film and the image. Such as cracks, shrinkage cavities, pores, slag inclusions, unmelted, incomplete
Máy X Ray để bàn có dấu chân nhỏ Máy di động nhỏ gọn cho chất bán dẫn điện
Unicomp CX3000 Small footprint compact portable Desktop X-ray Machine For Electrnoics Semiconductor Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
Máy đo tự động tia X Unicomp AX8200MAX 2.5D cho PCBA BGA QFN
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
Máy Unicomp X Ray thời gian thực AX8200MAX Ống kín 5 micron để kiểm tra khoảng trống SMT EMS BGA
Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD
CX3000 Reel To Reel Điện tử Máy X Ray 0,5kW cho CSP LED Flip Chip
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle
