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Chất lượng Chụp X quang NDT Unicomp X Ray Thiết bị để kiểm tra vết nứt hàn ống nhà máy

Chụp X quang NDT Unicomp X Ray Thiết bị để kiểm tra vết nứt hàn ống

Unicomp Riadiography NDT X-Ray inspection systems for pipes welding crack testing Applications: ● Cast parts and pressure Vessels ● Steel pipe,Cylinder and Wood ● Epoxy Resin Defect Detection ● Wheel,Tires and Metal parts Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development

Chất lượng Lập trình ngoại tuyến 1.6kW Unicomp X Ray AX9100 cho trình kết nối nhà máy

Lập trình ngoại tuyến 1.6kW Unicomp X Ray AX9100 cho trình kết nối

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Chất lượng Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV cho bo mạch chủ nhà máy

Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV cho bo mạch chủ

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Chất lượng Ống kín 3um Máy X Ray 1.6kW cho SMT BGA CSP nhà máy

Ống kín 3um Máy X Ray 1.6kW cho SMT BGA CSP

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,

Chất lượng Ống kín Microfocus Unicomp X Ray 130kV 3um cho SMT BGA hàn nhà máy

Ống kín Microfocus Unicomp X Ray 130kV 3um cho SMT BGA hàn

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati

Chất lượng Hệ thống kiểm tra tia X Unicomp Microfocus 130kV 3um cho hình ảnh FPD nhà máy

Hệ thống kiểm tra tia X Unicomp Microfocus 130kV 3um cho hình ảnh FPD

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Chất lượng Thời gian thực Unicomp X Ray 1.6kW AX9100 cho lắp ráp điện tử nhà máy

Thời gian thực Unicomp X Ray 1.6kW AX9100 cho lắp ráp điện tử

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Chất lượng BGA QFN Hệ thống kiểm tra tia X Unicomp 130KV với chuyển động 6 trục nhà máy

BGA QFN Hệ thống kiểm tra tia X Unicomp 130KV với chuyển động 6 trục

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Chất lượng Máy X Ray Ống Microfocus 3µM AX9100 cho CSP EMS BGA nhà máy

Máy X Ray Ống Microfocus 3µM AX9100 cho CSP EMS BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage