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Máy kiểm tra tia X điện tử AX7900 Unicomp 5μm Micro Focus Auto Void Detection BGA Solder Độ chính xác cao
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
An toàn thực phẩm Hệ thống kiểm tra tia X tự động 40-120kV để phát hiện kim
Food Safety Automatic X-ray Inspection Systems for Unpackaged Products Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
Bóng đơn thép không gỉ Unicomp X Ray 40-120kV với phần mềm
Max Voltage: 40-120kV Max Current: 0.2-7.5mA Dimension(WxDxH,mm): 1600x790x1800 Weight: 500kg Inspection Accuracy(mm): Stainless Steel Ball ø0.5,Stainless Steel Wire 0.2x1.5, Glass2.0,Plastic 1.5 Safety:
Ống kín không bảo trì 90kV Máy SMT X-Ray Unicomp AX8200MAX để đo khoảng trống hàn LED BGA
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
Ngoại tuyến AX8200Max SMT EMS X Ray Máy đo tự động
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
AX8200max Hệ thống tia X của Unicomp để kiểm tra khiếm khuyết nội bộ của các thành phần điện tử
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
Máy kiểm tra tia X PCB kín AX8200max Với hiệu suất cao
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
AX8200max Máy chiếu tia X PCB 90kV Với chức năng nghiêng ± 60 ° Để kiểm tra hiệu quả
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Application Fields of SMT X-Ray machine Unicomp AX8200MAX BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
Phân tích X quang kỹ thuật số và kiểm tra tia X của xương khớp UNC320
Resopution Digital Radiography And Knuckle X-Ray Inspection UNC320 For Aluminum Castings Checking Product Description: Primarily intended for non-destructive testing applications, this technique is extensively employed in metal castings, hardware components, plastic products, refractory materials, resin-based materials, composite materials, ceramic bodies, and various welding metal parts, among other small-scale products. It ensures the quality and integrity of these
