CMM 2026 | UniXray AI Unlocks a New Era of Intelligent Electronic Inspection

CMM2026 & UNICOMP

South China International Industry Fair (10th Electronic Manufacturing Automation & Resources Exhibition) serves as a platform connecting global smart manufacturing exchanges. Centered on the theme “Intelligence, Interconnection, Empowering New Industrial Growth”, it focuses on “AI + Smart Manufacturing”.

UnicompXray (Booth No.: Booth B029, Hall 11)
Drawing insights into industry demands, UniXray showcases its full-process intelligent electronic inspection solution powered by AI+X-ray at the exhibition. Supported by a technological ecosystem featuring a full spectrum of core components and industrialized intelligent equipment for all application scenarios, we empower quality and efficiency upgrades across the entire smart electronics manufacturing chain.

Full Portfolio Coverage of Core Components

Spanning millimeter-scale PCBs, micron-level chips and nanoscale interconnections, UniXray X-ray sources have built a full-scale penetrative quality inspection system. The system precisely identifies micro-defects including cold solder joints, voids and cracks, effectively addressing quality control challenges arising from the miniaturization and high integration of electronic devices. It delivers self-developed, controllable core technical support for high-end intelligent inspection.

AI-Powered Intelligent Inspection: Empower All Application Scenarios

Looking ahead, UniXray will keep pushing the boundaries of industrial non-destructive X-ray intelligent inspection through AI innovation. With platform-based inspection capabilities, we will fortify the quality barrier for smart electronics manufacturing and fuel high-quality industrial development.