logo
Chào mừng đến Unicomp Technology
+86-13502802495

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Thuộc tính cơ bản
Nơi xuất xứ: Trung Quốc
Tên thương hiệu: UNICOMP
Chứng nhận: CE, FDA
Số mô hình: AX9100max
Giao dịch Bất động sản
Số lượng đặt hàng tối thiểu: 1 bộ
Giá: can negotiate
Điều khoản thanh toán: L/C,T/T
Khả năng cung cấp: 100 bộ/tháng
Tóm tắt sản phẩm
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Chi tiết sản phẩm

Làm nổi bật:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Monitor: Màn hình 27"HD
System OS: Windows10 64-bit
Hard Disk: 1TB
RAM: 16g
CPU Model: i7
Mô tả sản phẩm
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 0
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 1
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 2
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 3
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 4
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Đánh giá chung
5.0
★★★★★
★★★★★
Dựa trên 50 đánh giá gần đây
5 SAO
100%
4 sao
0
3 sao
0
2 sao
0
1 sao
0
Tất cả các đánh giá
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
  • M
    M*k
    Albania Dec 3.2025
    ★★★★★
    ★★★★★
    good machine
  • P
    Peter
    France Feb 20.2025
    ★★★★★
    ★★★★★
    good product
Sản phẩm liên quan

Gửi Yêu Cầu