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5μm Focus Spot PCBA Plated Through Hole Xray Inspection Machine AX8300 Unicomp PTH Void Defect Detector

Thuộc tính cơ bản
Nơi xuất xứ: Trung Quốc
Tên thương hiệu: UNICOMP
Chứng nhận: CE, FDA
Số mô hình: AX8300
Giao dịch Bất động sản
Số lượng đặt hàng tối thiểu: 1 BỘ
Giá: can negotiate
Điều khoản thanh toán: T/T, L/C
Khả năng cung cấp: 30 bộ mỗi tháng
Tóm tắt sản phẩm
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...

Chi tiết sản phẩm

Làm nổi bật:

5μm Focus Spot PCBA Xray Machine

,

Plated Through Hole Inspection Detector

,

AX8300 PTH Void Defect Machine

Warranty: 1 năm
Product Name: AX8300
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350kg
Dimension: 1215*1325*1700(mm)
Voltage: 110kV
Mô tả sản phẩm
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects such as BGA voids, solder cracks, welding shortages and internal packaging flaws.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
  • BGA/CSP/FLIPS CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
  • QFN: Bridging, Voids, Opens, Registration
  • SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
  • Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
  • Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
Model AX8300
Max kV/Type 110 kV/Sealed
Power Consumption 900W
Max. Electron Beam Power 25W
Focal Spot Size 5μm
Geometric Magnification 48.8X
Imaging System (Option) Flat Panel Detector
Door Open Hand-operated door
Monitor 27" HD 4K Display
Dimensions 115x1325x1700mm
Weight 1350kg
Radiation Safety <1μSv/hr
Control Keyboard/Mouse/Joystick
Automated Inspection Standard
Primary Applications Chip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment: All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Inspection Images
AX8300 X-ray inspection machine sample inspection image showing high-resolution PCB component analysis
Đánh giá chung
5.0
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    United States Jan 21.2026
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