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Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision

Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent

Metro Museum Expo Center Security X-Ray Scanner Machine UNX6040E Emission: Extremely low radiation dose adhering to all International Safety Standards. Environment: New advanced lead curtain pressure membrane technology effectively eliminating secondary lead (Pb) pollution. Power: Penetration equivalence of up to a 34mm steel plate. Operation: Intuitive operator interface and media interface for quick learning and optimization of the machine. Software/Imaging: Robust software